20-May-06
Siemens division, Huawei-3Com tie-up
The Communications Enterprise Network (Com EN) division of Siemens has entered into a strategic alliance with Huawei-3Com, which is a joint venture of 3Com, U.S., and Huawei of China, to offer futuristic IP based voice, data and video network solutions, which optimise the total cost of ownership for Indian enterprises. more...

19-May-06
Xilinx launches device for semi-conductor designing
Xilinx, a player in the programmable logic devices (PLD) market, has unveiled the newest version of its Virtex family of domain-optimised field programmable gate array (FPGA), for designing of chips.
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19-May-06
Use of re-programmable chips gaining momentum
Customers of consumer electronics products are constantly demanding new features in the devices they are using. more...

19-May-06
HelloSoft solutions to power 15 dual-mode mobile handsets
HelloSoft, a supplier of signal processing technology and software defined radio solutions for Voice over Internet Protocol (VoIP), WiFi, cellular and other converged markets, expects its solutions to be in 15 dual-mode mobile handset models by the end of this year.
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19-May-06
Xilinx unveils energy efficient chips
Xilinx unveiled faster, smaller FPGAs (field programmable gate arrays, basically re-configurable chips used in electronic devices) that consume 35 per cent less power than the previous ones.
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19-May-06
Siemens in pact with Huawei-3Com
Siemens Ltd has tied up with Huawei-3Com to offer Internet protocol-based voice, data, and video network solutions to enterprise customers in India.
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