19-August-08
Cell phones can do a lot more: Broadcom
Broadcom, recently launched a mobile connectivity solution, the BCM4325 chip, which combines Wi-Fi, Bluetooth and FM functionality into a single 65nm silicon die. With this, the company aims to significantly reducing the board space and power consumption typically required to add all three wireless features to mobile devices. more...

19-August-08
Japanese semicon firms seek India ties
The India Semiconductor Association (ISA) recently organized the India-Fukuoka (Japan) IT, Embedded Software and Semiconductor Business Workshop 2008. more...

18-August-08
LDK Solar to supply 300MW multicrystalline solar wafers to Indian module manufacturer
Indian based module manufacturer, XL Telecom & Energy Limited has secured a 300MW multicrystalline silicon solar wafer supply deal with LDK Solar. more...